FlexCB
FlexCB P2 Double-sided Flexible Circuit Board - 12" x 12" - Low Precision (min. 1 mm)
FlexCB P2 Double-sided Flexible Circuit Board - 12" x 12" - Low Precision (min. 1 mm)
NOT FOR CHILDREN. PROFESSIONAL USE ONLY.
This is not a normal paper nor a copper sheet commonly known Printed Circuit Board (PCB) clad.
Product Description:
The P2 sheet provides the simplest form of creating circuit boards using manual engraving and exposing tracks or using simple crafting machines such as a Cricut Maker or others.
Soldering flux should not be used on the board as it is corrosive to the board coating and will instantly damage the board.
Application Method:
The process is as easy as drawing simple circuit board at a lower resolution either by hand or use a laser printer toner transfer, and then exposing the tracks by erasing the surrounding areas simply by a hot engraver, preferably a temperature controlled soldering iron with pointy tip at 190°C to 230°C (380°F - 450°F).
Vias can be made with the same method by increasing the temperature, preferrable keeping it between 280°C and 330°C (520°F - 630°F) .
Soldering components does not require using flux or soldering wire. Just place the component to be soldered on the board and adjust the pins on the pads and use a 300°C hot soldering iron tip to slightly push the component to the board and they will bond.
Warnings:
The coating material on the surface can be harmful if touched, inhaled or get in the eyes or inside digestive system.
Product Specifications:
Size: 12 inch by 12 inch (300mm x 300mm)
Track resolution: Low-Precision (required minimum 1mm track width)
Components used: All manual through-hole and SMB with exposed pins are allowed, but components with hidden contact pins such as Ball-Grid Array components cannot be used.
Board type: Double-sided
Main coating ingredients: Silver-Copper powder (99.3% Cu/0.7% Ag), conductive epoxy
Substrate material: Coarsely-formed polyethylene terephthalate (bi-axial for strengthen substrate, coarse surface for strengthen the bonding of coating on the substrate)
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